Daily Feed Digest — 2026-05-16

本质与导读

由 worker handleFeedDigest 自动生成 (轻量版,12/13 RSS 源,20 top items)。 完整版 (91 源 + per-item LLM summary) 由 .github/workflows/feed.yml manual trigger。

AI 总结

GaN 与 SiC 竞争格局: GaN 在机器人关节电机驱动中确立主导地位,EPC 与 TI 专家在 APEC 2026 上强调“先解决最难问题”是 GaN 胜出的关键;SiC JFET 则在固态断路器与人形机器人电源架构中取得新进展,SuperQ 架构也带来新设计思路。

EV 产业与政策震荡: Subaru Q4 利润骤降,因美国政策转向而推迟 BEV 计划;中国则反向操作,拟借鉴日本 K-Car 模式推出标准化廉价电动车以刺激销量;瑞士 SCHURTER 收购中国 Biaodi 多数股权,补全高压与烟火式 EV 熔断器产品线。

前沿技术与标准: MIPI 联盟成立 Physical AI 工作组,聚焦人形机器人接口标准化;ROHM 推出 NFC 无线充电芯片组,专攻智能戒指等超紧凑可穿戴;Vishay 发布车规级 3000W TVS 保护器件,兼顾紧凑与可润湿侧翼工艺。

电网与储能优化: 三篇 arXiv 论文分别探讨光储混合系统多市场最优设计、基于继电式极值搜索的构网型控制瞬态优化,以及导纳引导的逆变器指令操控攻击对微电网稳定性的威胁。

半导体行业宏观: 行业周报提及 H200 芯片对华出货受阻、2030 年 1.5 万亿美元 IC 市场预测、福特新动态及太阳能嵌入窗户芯片等。

最值得点开:

  1. 《Humanoid Robotics is a Power Electronics Problem》——直接点明人形机器人产业瓶颈在功率电子,GaN 方案细节极具参考价值。
  2. 《Subaru’s EBIT collapsed in Q4, BEVs now postponed》——以真实财报揭示政策转向对传统车企 BEV 战略的冲击,是产业风向标。
  3. 《Optimal design of solar-battery hybrid resources...》——针对多市场参与下的光储优化建模,对储能投资与电网调度有直接指导意义。

Top 20 条

1. NFC wireless power chipset targets compact wearables

:Power Electronics Tips score:30 日期:Sun, 03 May 2026 17:59:10 +0000

ROHM Semiconductor has introduced the ML7670/ML7671 wireless power chipset for NFC-based charging in compact wearables such as smart rings, smart bands and smart pens. Operating at 13.56MHz, the chipset supports up to 250mW power transfer, while the ML7670 receiver achieves up to 45% efficiency in a 2.28 × 2.56 × 0.48mm package and integrates the […] The post NFC wireless power chipset targets com

2. SiC JFETs in Solid-State Circuit Breakers, Humanoid Robotics, SuperQ’s New Architecture: Power Electronics Week Insights

:Power Electronics News score:30 日期:Fri, 15 May 2026 14:00:00 +0000

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on SiC JFETs in Solid-State Circuit Breakers, Humanoid Robotics, and SuperQ’s New Architecture! The post SiC JFETs in Solid-State Circuit Breakers, Humanoid Robotics, SuperQ’s New Architecture: Power Electronics Week Insights appeared first on Power Electronics News.

3. Humanoid Robotics is a Power Electronics Problem

:Power Electronics News score:30 日期:Tue, 12 May 2026 13:00:00 +0000

Experts from EPC and Texas Instruments explain why GaN dominates humanoid robot motor drive design at the joint level. The post Humanoid Robotics is a Power Electronics Problem appeared first on Power Electronics News.

4. Chip Industry Week in Review

:Semiconductor Engineering score:30 日期:Fri, 15 May 2026 07:01:42 +0000

What happened to H200 chips for China? $1.5T IC industry by 2030; new funding; AI memory tools; MRC spec; embedding solar chips in windows; Ford launches battery biz; Waymo does the backstroke; UMC's high-voltage finFET. The post Chip Industry Week in Review appeared first on Semiconductor Engineering.

5. Subaru’s EBIT collapsed in Q4, BEVs now postponed

:Automotive World score:30 日期:Fri, 15 May 2026 15:32:45 +0000

Subaru, suddenly conscious that US regulations no longer favour electric vehicles, abruptly decided to impair its assets. By Will Girling The post Subaru’s EBIT collapsed in Q4, BEVs now postponed appeared first on Automotive World.

6. Chroma’s battery tester validated Orion’s lithium-ion systems for NASA’s Artemis II crewed lunar mission

:Charged EVs score:30 日期:Fri, 15 May 2026 15:40:27 +0000

Chroma Systems Solutions has announced that its Chroma 17020 Battery Test System was used to evaluate the lithium-ion battery systems aboard NASA’s Orion crew capsule for the Artemis II mission—the first crewed Artemis flight, a circumlunar voyage carrying four astronauts. Testing happened in two phases. First, the 17020 was used in lab conditions to evaluate... Read more »

7. SCHURTER acquires majority stake in China’s Biaodi, adding pyrotechnic and high-voltage EV fuses to its lineup

:Charged EVs score:30 日期:Thu, 14 May 2026 15:36:24 +0000

Swiss electronic components maker SCHURTER has completed the acquisition of a majority stake in Biaodi, a China-based developer of high-voltage circuit protection products for electric vehicles and new energy applications. Biaodi’s portfolio covers three product categories: fuses for EV onboard applications, pyrotechnic fuses for emergency disconnection in electric vehicles, and AC fuses for

8. China wants to build its own electric K-car industry to boost EV sales

:Electrek score:30 日期:Thu, 14 May 2026 14:28:11 +0000

China’s top auto industry group is calling for the creation of a standardized budget electric vehicle category — modeled on Japan’s wildly popular K-car ecosystem — to revive sluggish domestic car sales and bring millions of new buyers into the EV market.

The proposal, from the head of the China Passenger Car Association (CPCA), would target elderly consumers and rural markets where cheap, unre

9. MIPI Alliance Forms Physical AI Group Focused on Humanoids

:Embedded.com score:30 日期:Tue, 12 May 2026 23:29:03 +0000

The MIPI Alliance has announced the formation of a Physical AI Birds of a Feather (BoF) group focused on emerging technologies in the physical AI market, with an initial emphasis on humanoid robotics. The initiative is designed to evaluate how existing and future MIPI interface specifications can support the rapidly evolving humanoid application ecosystem. The [...] The post MIPI Alliance Forms Ph

10. LPWAN for IIoT: A Technical Comparison of LoRaWAN and NB-IoT

:Embedded.com score:30 日期:Mon, 11 May 2026 19:19:21 +0000

In recent years, wireless networks have evolved to the point where a communication protocol is needed that allows devices to be connected over very long distances and with reduced energy consumption. A low-power wide-area network (LPWAN) is the basic infrastructure needed to connect distributed objects to the grid, ensuring energy efficiency and wide coverage. Wireless [...] The post LPWAN for IIo

11. Optimal design of solar-battery hybrid resources considering multi-market participation under weather and price uncertainty

:arXiv eess.SY score:30 日期:Fri, 15 May 2026 00:00:00 -0400

arXiv:2605.14043v1 Announce Type: new Abstract: The rapid growth of variable renewable energy has increased the need for flexible and efficiently coordinated energy resources. In this context, hybrid resources that combine renewable generation and battery storage within a single market-participating entity have attracted growing attention. Such hybrid resources can have multiple revenue streams,

12. Optimizing Grid-Forming Controls using Relay-based Extremum Seeking to Enhance Transient Performance

:arXiv eess.SY score:30 日期:Fri, 15 May 2026 00:00:00 -0400

arXiv:2605.14161v1 Announce Type: new Abstract: Grid-forming (GFM) inverters are essential for enhancing stability in modern power systems with high penetration of inverter-based resources (IBRs). However, their performance highly depends on control parameters tuning, particularly the active power-frequency droop coefficient. This parameter presents a trade-off among competing objectives, includi

13. Admittance-Guided Inverter Dispatch Command Manipulation Attack: A Grid Stability-Oriented Approach

:arXiv eess.SY score:30 日期:Fri, 15 May 2026 00:00:00 -0400

arXiv:2605.14509v1 Announce Type: new Abstract: The high penetration of voltage source converters in modern smart microgrids enhances operational flexibility while introducing complex cyber-physical vulnerabilities. Existing cyber-attack studies either require detailed knowledge of system topology and controller dynamics or depend on repeated online interactions, which may compromise practicality

14. “Solve the hardest problem first,” Alex Lidow on winning the GaN race

:Power Electronics Tips score:20 日期:Fri, 08 May 2026 14:21:47 +0000

At APEC 2026, EPC CEO Alex Lidow spoke with EEWorld Director Aimee Kalnoskas and Power Electronics Author Jeff Shepard for a conversation that goes far beyond GaN hype. From pioneering GaN adoption in AI server boards and scaling “apex” applications like humanoid robotics, to navigating fierce competition, IP battles, and shifting US innovation policy, Lidow […] The post “Solve the hardest problem

15. Vishay Unveils Automotive-Grade 3000 W TVS Protection Devices

:Power Electronics News score:20 日期:Thu, 14 May 2026 15:00:00 +0000

The new TVS diodes combine 3000 W protection, compact packaging, and wettable flanks for automotive and industrial use. The post Vishay Unveils Automotive-Grade 3000 W TVS Protection Devices appeared first on Power Electronics News.

16. Power Corner: iDEAL’s SuperQ Tapping Si’s Potential Beyond Superjunction

:Power Electronics News score:20 日期:Thu, 14 May 2026 13:00:00 +0000

iDEAL Semiconductor's SuperQ replaces P-N pillars with high-K dielectric trenches to redefine silicon MOSFET cost-performance. The post Power Corner: iDEAL’s SuperQ Tapping Si’s Potential Beyond Superjunction appeared first on Power Electronics News.

17. Rethinking Superjunction’s Charge-Compensation Architecture with SuperQ

:Power Electronics News score:20 日期:Thu, 14 May 2026 13:00:00 +0000

SuperQ uses a nanometer-thin high-K dielectric film to rethink charge compensation in silicon power MOSFETs. The post Rethinking Superjunction’s Charge-Compensation Architecture with SuperQ  appeared first on Power Electronics News.

18. Cyient Launches India’s First GaN Power ICs

:Power Electronics News score:20 日期:Wed, 13 May 2026 22:00:27 +0000

The 650V GaN power ICs target AI, telecom, fast charging, and e-mobility applications with improved efficiency. The post Cyient Launches India’s First GaN Power ICs appeared first on Power Electronics News.

19. Infineon and d-Matrix Advance Energy-Efficient AI Infrastructure

:Power Electronics News score:20 日期:Tue, 12 May 2026 13:00:00 +0000

The collaboration combines Infineon power modules with d-Matrix AI accelerators for efficient low-latency inference. The post Infineon and d-Matrix Advance Energy-Efficient AI Infrastructure appeared first on Power Electronics News.

20. Micro-Transfer Printing (MTP) As A Promising Scalable Approach to Heterogeneous Integration for Silicon Photonics (Ghent U., imec et al)

:Semiconductor Engineering score:20 日期:Fri, 15 May 2026 18:44:10 +0000

A new technical paper, “Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook,” was published by researchers at Ghent University, imec et al. Abstract “This paper highlights micro-transfer printing (MTP) as a promising scalable approach to heterogeneous integration for silicon photonics. MTP uniquely achieves high integration density, high throughput