Daily Feed Digest — 2026-05-24

本质与导读

由 worker handleFeedDigest 自动生成 (轻量版,11/13 RSS 源,20 top items)。 完整版 (91 源 + per-item LLM summary) 由 .github/workflows/feed.yml manual trigger。

AI 总结

SiC 与功率模块演进: 博世第三代 SiC 通过降低电阻与优化开关行为,直接提升 EV 电驱效率并支持更经济的模块设计;Navitas 则聚焦 TAP SiC 栅氧可靠性验证,并预告将在 PCIM 2026 展示面向 AI 数据中心和电网的 GaN/SiC 方案。针对 800V+ SiC 逆变器,一款采用 NanoPlex™ LDF 薄膜的 DC-link 电容方案被重点讨论,以应对高温与高纹波挑战。

电池与热管理 意法半导体推出 L9963F 电池管理 IC,强化 EV 电池系统的安全、同步与监控能力。在热失控防护上,Freudenberg 的 DIAvent maxFlow 泄压阀可实现每秒 190 升以上的排气量,为高能量密度电池包提供关键安全冗余。

无线充电与接口保护: ROHM 推出基于 NFC 的 ML7670/7671 无线充电芯片组,瞄准智能戒指、手环等紧凑可穿戴设备;同时发布 RESDxVx 系列 ESD 保护二极管,支持 10 Gbps 以上车载高速接口(如以太网)的静电防护。

数据中心与基础设施: ADI 收购 Empower Semiconductor,强化 AI 数据中心所需的高密度电源与 IVR 技术。Quantica 为其 Big Sky 数字基础设施园区提交互联申请,旨在扩大发电能力,将电力、连接与土地打包开发。

整车与效率标杆: 起亚将停产最便宜燃油车 Picanto,并由一款约 2 万美元的新 EV 接替。特斯拉 Cybercab 获认证为史上最高效 EV(165 Wh/mi),远超其他车型,其效率数据本身即构成行业里程碑。

最值得点开:

  • #5 (Bosch Gen 3 SiC)#14 (Cybercab 效率):前者是 SiC 降本增效的工程范本,后者以实测数据定义了 EV 效率新基准,两者分别代表“技术落地”与“性能极限”两条关键线索。

Top 20 条

:Charged EVs score:50 日期:Fri, 22 May 2026 15:51:37 +0000

A technical look at NanoPlex™ LDF and the Power Ring Platform 800V+ SiC inverters place demands on DC-link capacitors that conventional dielectric films cannot meet. Advanced Conversion has addressed this for years through its patented Power Ring platform, paired with high-temperature PEN HV polymer dielectric film. However, with the high-temperature film supplier exiting the market,... Read more

2. NFC wireless power chipset targets compact wearables

:Power Electronics Tips score:30 日期:Sun, 03 May 2026 17:59:10 +0000

ROHM Semiconductor has introduced the ML7670/ML7671 wireless power chipset for NFC-based charging in compact wearables such as smart rings, smart bands and smart pens. Operating at 13.56MHz, the chipset supports up to 250mW power transfer, while the ML7670 receiver achieves up to 45% efficiency in a 2.28 × 2.56 × 0.48mm package and integrates the […] The post NFC wireless power chipset targets com

3. ST Launches Enhanced Lithium Battery Management IC

:Power Electronics News score:30 日期:Fri, 22 May 2026 16:00:00 +0000

ST’s new L9963F battery-management IC improves safety, synchronization, and monitoring for EV battery systems. The post ST Launches Enhanced Lithium Battery Management IC appeared first on Power Electronics News.

4. Navitas’ TAP SiC Gate Oxide Reliability, Bosch Gen3 SiC, pSemi’s Adiabatic Charge Pump: Power Electronics Week Insights

:Power Electronics News score:30 日期:Fri, 22 May 2026 14:00:00 +0000

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Navitas’ TAP SiC Gate Oxide Reliability, Bosch Gen3 SiC, and pSemi’s Adiabatic Charge Pump! The post Navitas’ TAP SiC Gate Oxide Reliability, Bosch Gen3 SiC, pSemi’s Adiabatic Charge Pump: Power Electronics Week Insights appeared first on Power Electronics News.

5. How Bosch Gen 3 SiC Improves EV Powertrain Efficiency

:Power Electronics News score:30 日期:Fri, 22 May 2026 13:00:00 +0000

The third-generation Bosch SiC reduces resistance, improves switching behavior, and supports more cost-effective power module design. The post How Bosch Gen 3 SiC Improves EV Powertrain Efficiency appeared first on Power Electronics News.

6. Navitas Unveils AI Data Center and Grid Power Technologies at PCIM 2026

:Power Electronics News score:30 日期:Thu, 21 May 2026 16:00:00 +0000

Navitas will highlight GaN and SiC technologies for AI data centers, smart grids, and industrial electrification at PCIM 2026. The post Navitas Unveils AI Data Center and Grid Power Technologies at PCIM 2026 appeared first on Power Electronics News.

7. ADI Expands AI Infrastructure Strategy With Empower Acquisition

:Power Electronics News score:30 日期:Thu, 21 May 2026 12:50:18 +0000

Analog Devices will acquire Empower Semiconductor to expand AI-focused high-density power and IVR technology capabilities. The post ADI Expands AI Infrastructure Strategy With Empower Acquisition appeared first on Power Electronics News.

8. Quantica Files Interconnection Applications to Expand Power Generation for its Big Sky Digital Infrastructure Campus

:EE Journal score:30 日期:Fri, 22 May 2026 13:10:06 +0000

Quantica Infrastructure, LLC (Quantica), developer of integrated digital infrastructure combining power, connectivity, and land, that is sponsored by EnCap Investments L.P. (“EnCap”), filed interconnection applications with NorthWestern Energy to expand power generation for its 1,100 MW Big Sky Campus in Yellowstone County. The expanded power is designed to support potential long-term customer dem

9. Novel ‘organ-on-chip’ project to study the connection between diabetes and dementia

:EE Journal score:30 日期:Thu, 21 May 2026 13:01:56 +0000

A University of Bath-led project has secured £500,000 to develop a first-of-its-kind ‘organ-on-chip’ device that replicates connections between the brain, gut and pancreas. The GlucoBrain project will allow researchers to track how signals move between the organs and uncover why diabetes may lead to changes in memory and cognition. The study is led by world-leading … Read More →

10. Commercial Space Screening Approach for Agile, High-Reliability Payloads

:EE Times score:30 日期:Fri, 22 May 2026 14:14:23 +0000

Date: Tuesday, June 30, 2026 Time: 15:00 CEST As the Space market evolves and accelerates, mission designers need space-capable electronics that balance performance, reliability, and affordability, without sacrificing speed to deployment.  Join this webinar where we’ll explore ADI’s approach to supporting New Space programs through our purpose-built screening flows: Commercial Space Low

11. ROHM’s new ESD diodes protect 10+ Gbps automotive interfaces

:Charged EVs score:30 日期:Fri, 22 May 2026 15:11:18 +0000

ROHM Semiconductor has introduced the RESDxVx series, ESD protection diodes targeting high-speed interfaces operating above 10 Gbps. The devices achieve terminal capacitance of 0.24 pF (bidirectional) and 0.48 pF (unidirectional) alongside a dynamic resistance of 0.28 Ω—a combination that addresses the core design challenge in this application. At data rates above 10 Gbps, even small... Read more

12. Freudenberg’s new DIAvent maxFlow vents over 190 liters per second in EV battery thermal runaway events

:Charged EVs score:30 日期:Thu, 21 May 2026 15:28:55 +0000

Freudenberg Sealing Technologies has released full specifications for the DIAvent maxFlow, a thermal runaway degassing element for lithium-ion vehicle batteries that delivers more than 190 liters per second at 300 mbar differential pressure—2.5 times the flow rate of the previous DIAvent HighFlow. The design replaces the rubber umbrella used in earlier DIAvent generations with a... Read more &#18

13. Kia is killing off its cheapest gas car, but a new EV will replace it

:Electrek score:30 日期:Fri, 22 May 2026 17:45:27 +0000

Starting at about $20,000, the Picanto is Kia’s most affordable new car in Europe, the UK, and several other global markets. The entry-level gas car is likely on its way out as part of the shift to electrification, but Kia has a new EV that will replace it.

more…

14. Tesla Cybercab: hate it or love it, it is the most efficient EV ever

:Electrek score:30 日期:Fri, 22 May 2026 15:17:18 +0000

Tesla’s Cybercab has been certified at 165 Wh/mi, making it the most efficient electric vehicle ever produced — by a wide margin. The next most efficient EV on the market, the Lucid Air Pure, consumes 28% more energy per mile.

Tesla VP of Vehicle Engineering Lars Moravy confirmed the figure, which represents a certified rating — not a marketing claim or internal target. It’s an impressive achie

15. Wheel-E Podcast: Lectric XPress2 launch, Amazon cargo quads, more

:Electrek score:30 日期:Fri, 22 May 2026 11:19:37 +0000

This week on Electrek’s Wheel-E podcast, we discuss the most popular news stories from the world of electric bikes and other nontraditional electric vehicles. This time, that includes new e-bike launches from the Lectric XPress2 to the Heybike Saturn, gigantic cargo e-bikes from Amazon, a deep dive into the Yozma IN10 Pro, Juiced’s Nomadix, and more.

more…

16. “Solve the hardest problem first,” Alex Lidow on winning the GaN race

:Power Electronics Tips score:20 日期:Fri, 08 May 2026 14:21:47 +0000

At APEC 2026, EPC CEO Alex Lidow spoke with EEWorld Director Aimee Kalnoskas and Power Electronics Author Jeff Shepard for a conversation that goes far beyond GaN hype. From pioneering GaN adoption in AI server boards and scaling “apex” applications like humanoid robotics, to navigating fierce competition, IP battles, and shifting US innovation policy, Lidow […] The post “Solve the hardest problem

17. Electrical Power Architecture of CubeSats and SmallSats

:Power Electronics News score:20 日期:Fri, 22 May 2026 15:00:00 +0000

CubeSat electrical power systems balance solar generation, battery management, and tight SWaP-C constraints in miniaturized spacecraft designs. The post Electrical Power Architecture of CubeSats and SmallSats appeared first on Power Electronics News.

18. Vishay Introduces High-Isolation Automotive Optocouplers

:Power Electronics News score:20 日期:Fri, 22 May 2026 15:00:00 +0000

The new Vishay optocouplers deliver high isolation and extended creepage distances for EV and solar power systems. The post Vishay Introduces High-Isolation Automotive Optocouplers appeared first on Power Electronics News.

19. The Adapter Fragmentation Problem and pSemi’s Adiabatic Charge Pump

:Power Electronics News score:20 日期:Thu, 21 May 2026 13:00:00 +0000

pSemi's multi-level buck and resonant charge pump technology underpin adaptive fast-charging ICs and a new push into humanoid robotics. The post The Adapter Fragmentation Problem and pSemi’s Adiabatic Charge Pump appeared first on Power Electronics News.

20. Chip Industry Week In Review

:Semiconductor Engineering score:20 日期:Fri, 22 May 2026 07:01:23 +0000

Taiwan, Europe packaging buildout; 2nm ramps; quantum big $; 2 new university hubs; agent honeypots; Samsung strike averted; extreme environment chip design; quantum-dot qubit device fabricated w/high-NA EUV; EU flagship power electronics project; CNTs. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.