Daily Feed Digest — 2026-05-26
本质与导读
由 worker handleFeedDigest 自动生成 (轻量版,13/13 RSS 源,20 top items)。 完整版 (91 源 + per-item LLM summary) 由 .github/workflows/feed.yml manual trigger。
AI 总结
SiC 与 GaN 功率器件方面: 多家厂商在 PCIM 2026 前后密集发布新品。Toshiba 推出 1200V SiC MOSFET,采用 QDPAK 封装以降低 AI 与工业电源的开关损耗;Wolfspeed 发布面向 AI 数据中心和可再生能源的高功率 SiC 模块;Bosch 第三代 SiC 技术通过降低导通电阻和优化开关行为,进一步提升了 EV 电驱效率;Navitas 则同时展示 GaN 和 SiC 方案,并专门回应了其 TAP SiC 栅氧可靠性问题。EV 电池与充电基础设施方面: ST 发布新款锂电池管理 IC L9963F,重点提升 EV 电池系统的安全性与同步监控能力;DHL 在荷兰开建 1.7 万平米欧洲电池物流枢纽,服务于 EV 电池仓储与运输;新西兰充电运营商 Meridian 达成第 500 个公共充电桩里程碑,显示区域网络仍在扩张。无线充电与接口保护方面: ROHM 推出基于 13.56MHz NFC 的无线充电芯片组 ML7670/7671,面向智能戒指等超紧凑可穿戴设备,无需 MCU 即可实现简化集成;同时 ROHM 还发布了支持 10Gbps+ 汽车高速接口的 ESD 保护二极管 RESDxVx 系列。系统设计与基础设施方面: 哥伦比亚大学与 IBM 联合发布 HSCO-Bench,一个面向异构 SoC 的端到端软硬件协同设计基准测试框架;Quantica 为其大型数字基础设施园区提交互联申请以扩展发电能力;另有一场关于商业航天高可靠载荷筛选方法的网络研讨会预告。
最值得点开的 2-3 条:
- Bosch Gen 3 SiC 如何提升 EV 电驱效率(第 7 条)—— 直接关系到下一代电驱成本与性能拐点,是 SiC 上车最务实的进展。
- Navitas 回应 TAP SiC 栅氧可靠性(第 6 条)—— 可靠性争议是 SiC 大规模应用的关键障碍,Navitas 的公开回应值得关注。
- HSCO-Bench 软硬件协同设计基准(第 9 条)—— 学术界与工业界联合推出的标准化评测框架,对异构芯片设计方法论有长期参考价值。
Top 20 条
1. Webinar: Sustaining high-temperature DC-link film for 800V+ SiC Inverters
源:Charged EVs score:50 日期:Fri, 22 May 2026 15:51:37 +0000
A technical look at NanoPlex™ LDF and the Power Ring Platform 800V+ SiC inverters place demands on DC-link capacitors that conventional dielectric films cannot meet. Advanced Conversion has addressed this for years through its patented Power Ring platform, paired with high-temperature PEN HV polymer dielectric film. However, with the high-temperature film supplier exiting the market,... Read more
2. NFC wireless power chipset targets compact wearables
源:Power Electronics Tips score:30 日期:Sun, 03 May 2026 17:59:10 +0000
ROHM Semiconductor has introduced the ML7670/ML7671 wireless power chipset for NFC-based charging in compact wearables such as smart rings, smart bands and smart pens. Operating at 13.56MHz, the chipset supports up to 250mW power transfer, while the ML7670 receiver achieves up to 45% efficiency in a 2.28 × 2.56 × 0.48mm package and integrates the […] The post NFC wireless power chipset targets com
3. Toshiba Starts Sampling 1200V SiC MOSFET in QDPAK Package
源:Power Electronics News score:30 日期:Mon, 25 May 2026 20:52:57 +0000
The new SiC MOSFET reduces switching and conduction losses for high-density AI and industrial power systems. The post Toshiba Starts Sampling 1200V SiC MOSFET in QDPAK Package appeared first on Power Electronics News.
4. Wolfspeed Debuts High-Power SiC Modules at PCIM 2026
源:Power Electronics News score:30 日期:Mon, 25 May 2026 13:36:39 +0000
The new Wolfspeed SiC modules improve efficiency and scalability for AI data centers and renewable energy systems. The post Wolfspeed Debuts High-Power SiC Modules at PCIM 2026 appeared first on Power Electronics News.
5. ST Launches Enhanced Lithium Battery Management IC
源:Power Electronics News score:30 日期:Fri, 22 May 2026 16:00:00 +0000
ST’s new L9963F battery-management IC improves safety, synchronization, and monitoring for EV battery systems. The post ST Launches Enhanced Lithium Battery Management IC appeared first on Power Electronics News.
6. Navitas’ TAP SiC Gate Oxide Reliability, Bosch Gen3 SiC, pSemi’s Adiabatic Charge Pump: Power Electronics Week Insights
源:Power Electronics News score:30 日期:Fri, 22 May 2026 14:00:00 +0000
Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Navitas’ TAP SiC Gate Oxide Reliability, Bosch Gen3 SiC, and pSemi’s Adiabatic Charge Pump! The post Navitas’ TAP SiC Gate Oxide Reliability, Bosch Gen3 SiC, pSemi’s Adiabatic Charge Pump: Power Electronics Week Insights appeared first on Power Electronics News.
7. How Bosch Gen 3 SiC Improves EV Powertrain Efficiency
源:Power Electronics News score:30 日期:Fri, 22 May 2026 13:00:00 +0000
The third-generation Bosch SiC reduces resistance, improves switching behavior, and supports more cost-effective power module design. The post How Bosch Gen 3 SiC Improves EV Powertrain Efficiency appeared first on Power Electronics News.
8. Navitas Unveils AI Data Center and Grid Power Technologies at PCIM 2026
源:Power Electronics News score:30 日期:Thu, 21 May 2026 16:00:00 +0000
Navitas will highlight GaN and SiC technologies for AI data centers, smart grids, and industrial electrification at PCIM 2026. The post Navitas Unveils AI Data Center and Grid Power Technologies at PCIM 2026 appeared first on Power Electronics News.
9. An Agent-Driven End-to-End HW-SW Co-Design Benchmark for Heterogeneous SoCs (Columbia, IBM)
源:Semiconductor Engineering score:30 日期:Mon, 25 May 2026 22:47:38 +0000
Researchers from Columbia University and IBM Research have released “HSCO-Bench: An Agent-Driven End-to-End Hardware-Software Co-design Benchmark for Systems-on-Chip”. Abstract “Large language models (LLMs) are adopted for software and hardware design, yet these domains are still evaluated separately. Software benchmarks typically assume fixed hardware targets, while hardware benchmarks focus on c
10. Quantica Files Interconnection Applications to Expand Power Generation for its Big Sky Digital Infrastructure Campus
源:EE Journal score:30 日期:Fri, 22 May 2026 13:10:06 +0000
Quantica Infrastructure, LLC (Quantica), developer of integrated digital infrastructure combining power, connectivity, and land, that is sponsored by EnCap Investments L.P. (“EnCap”), filed interconnection applications with NorthWestern Energy to expand power generation for its 1,100 MW Big Sky Campus in Yellowstone County. The expanded power is designed to support potential long-term customer dem
11. Commercial Space Screening Approach for Agile, High-Reliability Payloads
源:EE Times score:30 日期:Fri, 22 May 2026 14:14:23 +0000
Date: Tuesday, June 30, 2026 Time: 15:00 CEST As the Space market evolves and accelerates, mission designers need space-capable electronics that balance performance, reliability, and affordability, without sacrificing speed to deployment. Join this webinar where we’ll explore ADI’s approach to supporting New Space programs through our purpose-built screening flows: Commercial Space Low
12. Rohm Announces Compact Wireless Charging Chipset for Wearables
源:All About Circuits score:30
The new NFC wireless charging chipset uses 13.56-MHz technology and an MCU-free architecture to simplify wireless power integration in ultra-compact wearable devices, such as smart rings.
13. DHL Supply Chain to open EV battery hub at Holtum
源:Automotive World score:30 日期:Mon, 25 May 2026 04:35:53 +0000
DHL Supply Chain has begun construction on a 17,000 sq m European Battery Logistics Hub at Holtum in the Netherlands The post DHL Supply Chain to open EV battery hub at Holtum appeared first on Automotive World.
14. New Zealand EV charging provider Meridian hits 500 charging point milestone
源:Charged EVs score:30 日期:Mon, 25 May 2026 14:38:03 +0000
New Zealand EV charging provider Meridian has installed its 500th public charging point. The company has deployed charging stations at locations across the country, including Roxburgh, Haast, Mossburn, Dunedin South, Oamaru, Culverden, Rakaia, Rangiora, Punakaiki and Tokoroa. Meridian has focused on expanding charging access in the South Island over the past 12 months, and is... Read more »
15. ROHM’s new ESD diodes protect 10+ Gbps automotive interfaces
源:Charged EVs score:30 日期:Fri, 22 May 2026 15:11:18 +0000
ROHM Semiconductor has introduced the RESDxVx series, ESD protection diodes targeting high-speed interfaces operating above 10 Gbps. The devices achieve terminal capacitance of 0.24 pF (bidirectional) and 0.48 pF (unidirectional) alongside a dynamic resistance of 0.28 Ω—a combination that addresses the core design challenge in this application. At data rates above 10 Gbps, even small... Read more
16. Honda’s affordable EV hot hatch is ‘selling like hotcakes,’ priced at $21,000
源:Electrek score:30 日期:Mon, 25 May 2026 18:17:53 +0000
Starting at about $21,000, Honda said the electric hot hatch is already exceeding expectations with over 7,000 preorders.
more…
17. Kia is killing off its cheapest gas car, but a new EV will replace it
源:Electrek score:30 日期:Fri, 22 May 2026 17:45:27 +0000
Starting at about $20,000, the Picanto is Kia’s most affordable new car in Europe, the UK, and several other global markets. The entry-level gas car is likely on its way out as part of the shift to electrification, but Kia has a new EV that will replace it.
more…
18. Experimental Evaluation of Data Upload Efficiency and Guiding Challenges for a Vehicular-to-Road System Using 60-GHz mmWave Ultra-Spots
源:arXiv eess.SY score:30 日期:Mon, 25 May 2026 00:00:00 -0400
arXiv:2605.23223v1 Announce Type: new Abstract: Maximizing data uploading efficiency in a vehicular-to-road data uploading system using millimeter-wave communication is a challenging issue, as the wireless zone is often critically narrow, and vehicles can easily fail to pass through it without the aid of an autonomous guiding system. Variations in driving routes, speeds, approach angles, and dist
19. Physics-informed sparse identification-based tube model predictive control for aerial vehicles
源:arXiv eess.SY score:30 日期:Mon, 25 May 2026 00:00:00 -0400
arXiv:2605.23354v1 Announce Type: new Abstract: Autonomous aerial vehicles necessitate control strategies that balance computational efficiency with robust performance in dynamic operational environments. This paper proposes a model predictive control (MPC) framework for aerial platforms that leverages physics-informed machine learning (PIML) to achieve an optimal balance between computational tr
20. OptiQU: Coordinated Multi-Level Voltage and Reactive Power Control for Enhanced Voltage Quality and Secure Grid Operation
源:arXiv eess.SY score:30 日期:Mon, 25 May 2026 00:00:00 -0400
arXiv:2605.23505v1 Announce Type: new Abstract: Modern low-voltage (LV) distribution grids face rising shares of photovoltaic generation and high-power loads such as heat pumps and electric vehicle charging stations. Due to high simultaneity, voltage constraints often become binding before thermal limits, triggering costly conventional grid reinforcement measures. Existing voltage and reactive po